Die sorting

Convincing quality, flexibility and efficiency

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On a wafer, it is never the case that all microchips meet the specified tolerance limits. WGDicing GmbH conducts die sorting either as a subsequent step in its own sawing processes or as a separate service for delivered substrates. We are able to sort microchips on 6-inch or 8-inch wafer frames fully automatically into 2-inch and 4-inch waffle packs. If requested, WGDicing GmbH can also take care of pick & place operations into packaging and containers provided. 3 fully automatic die sorters are available.

Hexagonal or any asymmetrical shapes are sorted manually at WGDicing GmbH. This means that we can also do the sorting into any thermoformed trays or bulk containers. For this manual work, maximum concentration and thorough experience are of great importance. The employees of WGDicing GmbH bring along both qualities. This enables us to achieve minimum error rates and high sorting speeds in manual die sorting.