Machine Park

State-of-the-art technology for top quality and efficiency

The machinery of WGDicing GmbH is specialised in the separation of 6- and 8-inch wafers. In addition, round materials and tubes can likewise be diced in high quality and precision. Square, rectangular as well as hexagonal and octagonal objects can be produced as final formats. On request, we will examine the possibility of sawing special bodies or producing special formats. Please do not hesitate to contact us.

Within the scope of sawing and separating your wafers, substrates, ceramic materials and printed circuit boards, WGDicing GmbH offers the following services:


How to reach us

Wafer & Glassubstrate Dicing GmbH & Co. KG

Gewerbepark Birkenhain 26
63589 Linsengericht, Germany

Phone: +49 (0) 6051 91678-0
Fax: +49 (0) 6051 91678-20
Dicing: semi-automatic and fully automatic equipment
Dicing: semi-automatic and fully automatic equipment
  • ADT Pro Vectus 7100 Series
  • ADT Pro Dice 7200 Series
  • ADT 4" Pro Fortis 7100 Series
Die sorter
Die sorter
  • Besi Datacon 2200 evo
  • K&S Easyline 8031