Machine Park

State-of-the-art technology for top quality and efficiency

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The machinery of WGDicing GmbH is specialised in the separation of 6- and 8-inch wafers. In addition, round materials and tubes can likewise be diced in high quality and precision. Square, rectangular as well as hexagonal and octagonal objects can be produced as final formats. On request, we will examine the possibility of sawing special bodies or producing special formats. Please do not hesitate to contact us.

Within the scope of sawing and separating your wafers, substrates, ceramic materials and printed circuit boards, WGDicing GmbH offers the following services:

• Mounting of wafer material on a film
• Cutting based on customer specifications (shape, size, process conditions, etc.)
• Die sorting
• Measuring and inspecting
• Packaging